· AlN Ceramic substrate
·Chip technology: Flip chip
· View angle at 50% Iv of 120°
· Corrosion Robustness: Excellent corrosion robustness
· AEC-Q102 Qualified
· Suitable for SMT process
Forward
Current Typ.
Luminous
Flux Typ.
CCT Typ.
Voltage Typ.
1000 mA
2.3╳1.9×0.75 mm
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